faculty positions in various fields
The UESTC is now welcoming international faculty at all career stages. We are open to outstanding senior scholars and exceptional young scientists from all backgrounds for faculty positions in the following fields.
Information &Communication Engineering
Electronic Science and Engineering
Materials and Energy
Mechanical and Electrical Engineering
Automation Engineering
Computer Science and Engineering
Information and Software Engineering
Mathematical Sciences
Physics
Biomedical engineering
Medicine
Optoelectronic Science and Engineering
Aeronautics and Astronautics
Resources and Environment
Fundamental and Frontier Sciences
Languages and Linguistics
Management and Economics
Requirements:
The applicant in principle should have publications in top journals of the related field;
The applicant should have a doctorate degree with research areas in Natural Science, Engineering Technology, Management Science, etc;
The applicant should have been holding a formal teaching or research position in an well-known international university, scientific research institute or enterprise.
The applicant should have made well-recognized achievements and has the potential to lead the field in the near future
Remuneration:
A startup fund of RMB 2-6 million , grant senor professorship and doctoral supervisor-ship with yearly fixed PhD student quota, all for three years.
A basic salary of RMB 600,000 per year
A relocation subsidy of RMB 1.8-2.2 million (including the part by both the state and the local governments);"
Assistance to spouse relocation, children education, family social insurance, family health care, etc.
Access to first-lass China-domestic medical service for health examination as well as other medical care.
Special Note:
To assist prospective applicants in getting to know the University of Electronic Science and Technology of China (UESTC), the university invites candidates to visit Chengdu, Sichuan, China. UESTC will provide full support for round-trip airfare and accommodation expenses during the visit.